Semiconductor wafer bonding : science and technology / Q. -Y. Tong, U. Gösele
| Material Type | Books |
|---|---|
| Publisher | New York : John Wiley |
| Year | c1999 |
| Language | English |
| Size | xviii, 297 p. ; 24 cm |
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| Location | Volume | Call No. | Barcode No. | Status | ISBN | Media type | Restriction | Request Memo | Reserve |
|---|---|---|---|---|---|---|---|---|---|
| 1F書庫3-洋書 |
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549.8/G 69 | 010087452 | 0471574813 | 図書 |
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| Notes | Includes index |
|---|---|
| Authors | *Gösele, U. Tong, Q.-Y |
| Subjects | LCSH:Semiconductors -- Bonding LCSH:Semiconductor wafers |
| Classification | LCC:TK7871.85 DC21:621.3815/2 |
| ID | 1000049187 |
| ISBN | 0471574813 |
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