Material Type | Books |
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Publisher | Weinheim : Wiley-VCH |
Year | c2012 |
Language | English |
Size | xxxi, 395 p. : ill. (some col.), port ; 25 cm |
Location | Volume | Call No. | Barcode No. | Status | ISBN | Media type | Restriction | Request Memo | Reserve |
---|---|---|---|---|---|---|---|---|---|
2F-シラバス |
|
549.8/R 13 | 3000008986 | 9783527326464 | 図書 |
|
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Notes | Includes bibliographical references and index |
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Authors | Ramm, Peter Lu, James Jian-Qiang Taklo, Maaike M. V. |
Subjects | LCSH:Semiconductor wafers LCSH:Semiconductors -- Bonding |
Classification | DC23:621.38152 LCC:QC611.6.S9 |
ID | 4000009569 |
ISBN | 9783527326464 |
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