Semiconductor wafer bonding : science and technology / Q. -Y. Tong, U. Gösele
| データ種別 | 図書 |
|---|---|
| 出版者 | New York : John Wiley |
| 出版年 | c1999 |
| 本文言語 | 英語 |
| 大きさ | xviii, 297 p. ; 24 cm |
所蔵情報を非表示
| 配架場所 | 巻 次 | 請求記号 | 登録番号 | 状 態 | ISBN | 資料種別 | 利用注記 | 請求メモ | 予約 |
|---|---|---|---|---|---|---|---|---|---|
| 1F書庫3-洋書 |
|
549.8/G 69 | 010087452 | 0471574813 | 図書 |
|
|
|
書誌詳細を非表示
| 一般注記 | Includes index |
|---|---|
| 著者標目 | *Gösele, U. Tong, Q.-Y |
| 件 名 | LCSH:Semiconductors -- Bonding LCSH:Semiconductor wafers |
| 分 類 | LCC:TK7871.85 DC21:621.3815/2 |
| 書誌ID | 1000049187 |
| ISBN | 0471574813 |
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