Handbook of wafer bonding / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo
| データ種別 | 図書 |
|---|---|
| 出版者 | Weinheim : Wiley-VCH |
| 出版年 | c2012 |
| 本文言語 | 英語 |
| 大きさ | xxxi, 395 p. : ill. (some col.), port ; 25 cm |
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| 配架場所 | 巻 次 | 請求記号 | 登録番号 | 状 態 | ISBN | 資料種別 | 利用注記 | 請求メモ | 予約 |
|---|---|---|---|---|---|---|---|---|---|
| 2F-シラバス |
|
549.8/R 13 | 3000008986 | 9783527326464 | 図書 |
|
|
|
書誌詳細を非表示
| 一般注記 | Includes bibliographical references and index |
|---|---|
| 著者標目 | Ramm, Peter Lu, James Jian-Qiang Taklo, Maaike M. V. |
| 件 名 | LCSH:Semiconductor wafers LCSH:Semiconductors -- Bonding |
| 分 類 | DC23:621.38152 LCC:QC611.6.S9 |
| 書誌ID | 4000009569 |
| ISBN | 9783527326464 |
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