Handbook of wafer bonding / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo
| Material Type | Books |
|---|---|
| Publisher | Weinheim : Wiley-VCH |
| Year | c2012 |
| Language | English |
| Size | xxxi, 395 p. : ill. (some col.), port ; 25 cm |
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| Location | Volume | Call No. | Barcode No. | Status | ISBN | Media type | Restriction | Request Memo | Reserve |
|---|---|---|---|---|---|---|---|---|---|
| 2F-シラバス |
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549.8/R 13 | 3000008986 | 9783527326464 | 図書 |
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| Notes | Includes bibliographical references and index |
|---|---|
| Authors | Ramm, Peter Lu, James Jian-Qiang Taklo, Maaike M. V. |
| Subjects | LCSH:Semiconductor wafers LCSH:Semiconductors -- Bonding |
| Classification | DC23:621.38152 LCC:QC611.6.S9 |
| ID | 4000009569 |
| ISBN | 9783527326464 |
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